talos-op-linux - Talos™ II Linux sources for OpenPOWER

	Commit message (Collapse)	Author	Age	Files	Lines
*	usb: dwc3: exynos: remove non-DT support for Exynos Specific Glue layer	Jingoo Han	2014-11-05	1	-24/+0
\| \| \| \| \| \| \| \| \| \| \| \| \| \|	DWC3 Exynos Specific Glue layer can be used only for Exynos SoCs. In addition, non-DT for EXYNOS SoCs is not supported from v3.11; thus, there is no need to support non-DT for DWC3 Exynos Specific Glue layer. The 'linux/platform_data/dwc3-exynos.h' file has been used for non-DT support. Thus, the 'dwc3-exynos.h' file is removed, because it is not used anymore. Signed-off-by: Jingoo Han <jg1.han@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com>
*	usb: dwc3: Add Exynos Specific Glue layer	Anton Tikhomirov	2012-03-02	1	-0/+24
	Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com>