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authorChristian Geddes <crgeddes@us.ibm.com>2018-11-30 11:36:45 -0600
committerDaniel M. Crowell <dcrowell@us.ibm.com>2018-12-06 18:59:28 -0600
commit9e89b556adb60d42b33353091165e25679490bdd (patch)
tree5e84a10fc3d0425e8e9d12f4e5fb6b394551cde9
parent2555c39c6f9c365cbdc2376ded59ae5f4d8a3c42 (diff)
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Add README.md to src/usr/i2c/ which describes P9 I2C layout
There is a hard copy of a wiring diagram that has been floating around but I cant find this information in our codebase so I thought I would add it. Change-Id: I1cf606c2699a736743128b3c29827acee68fa6bd Reviewed-on: http://rchgit01.rchland.ibm.com/gerrit1/69308 Tested-by: Jenkins Server <pfd-jenkins+hostboot@us.ibm.com> Tested-by: Jenkins OP Build CI <op-jenkins+hostboot@us.ibm.com> Tested-by: Jenkins OP HW <op-hw-jenkins+hostboot@us.ibm.com> Tested-by: FSP CI Jenkins <fsp-CI-jenkins+hostboot@us.ibm.com> Reviewed-by: Michael Baiocchi <mbaiocch@us.ibm.com> Reviewed-by: Hieu C. Nguyen <hieu.nguyen@us.ibm.com> Reviewed-by: Daniel M. Crowell <dcrowell@us.ibm.com>
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+## P9 I2C attachments (External devieces and driving I2C master engines)
+
+Each processor has a CFAM I2C master that connects to the FSP in additon to
+a Quad I2C master chiptlet that houses 4 PIB I2CM devices. These I2C master
+devices connect to the SBE , the VPD , the TPM/PCIE, and the DIMMs.
+
+### I2C Masters in the P9 Proc Chiplet
+
+CFAM I2CM_A = FSP
+
+PIB I2CM_B = SBE seeproms = Engine0
+
+PIB I2CM_C = VPD/SBE seeproms = Engine1
+
+PIB I2CM_D = TPM/PCIE HotPlug = Engine2
+
+PIB I2CM_E = DIMMs = Engine3
+
+
+### I2C Master Connections
+
+
+**CFAM I2CM_A** - connects to seeprom0(MVPD), seeprom1(SBE), seeprom2(MVPD),
+seeprom3(SBE), CXPs (hostboot ignores), GPUs, DIMMs, and the DPSS/Spare
+
+**PIB I2CM_B** - connects to seeprom1(SBE) and seeprom3(SBE)
+
+**PIB I2CM_C** - connects to seeprom0(MVPD), seeprom1(SBE), seeprom2(MVPD),
+seeprom3(SBE),CXPs (hostboot ignores), GPUs, and the DPSS/Spare
+
+**PIB I2CM_D** - connects to TPM and PCIe HotPlugs
+
+**PIB I2CM_E** - connects to DIMMs
+
+
+**NOTE:** many of these devices have multiple masters, becausue of this masters
+must handshake before communicating to make sure collisions do not occur.
+
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