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* dt-bindings: interconnect: Add Qualcomm MSM8916 DT bindingsGeorgi Djakov2020-01-071-0/+77
| | | | | | | | The Qualcomm MSM8916 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
* Merge tag 'devicetree-for-5.5' of ↵Linus Torvalds2019-12-022-45/+77
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull Devicetree updates from Rob Herring: - DT schemas for PWM, syscon, power domains, SRAM, syscon-reboot, syscon-poweroff, renesas-irqc, simple-pm-bus, renesas-bsc, pwm-rcar, Renesas tpu, at24 eeprom, rtc-sh, Allwinner PS/2, sharp,ld-d5116z01b panel, Arm SMMU, max77650, Meson CEC, Amlogic canvas and DWC3 glue, Allwinner A10 mUSB and CAN, TI Davinci MDIO, QCom QCS404 interconnect, Unisoc/Spreadtrum SoCs and UART - Convert a bunch of Samsung bindings to DT schema - Convert a bunch of ST stm32 bindings to DT schema - Realtek and Exynos additions to Arm Mali bindings - Fix schema errors in RiscV CPU schema - Various schema fixes from improved meta-schema checks - Improve the handling of 'dma-ranges' and in particular fix DMA mask setup on PCI bridges - Fix a memory leak in add_changeset_property() and DT unit tests. - Several documentation improvements for schema validation - Rework build rules to improve schema validation errors - Color output for dtx_diff * tag 'devicetree-for-5.5' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (138 commits) libfdt: define INT32_MAX and UINT32_MAX in libfdt_env.h dt-bindings: arm: Remove leftover axentia.txt of: unittest: fix memory leak in attach_node_and_children of: overlay: add_changeset_property() memory leak dt-bindings: interrupt-controller: arm,gic-v3: Add missing type to interrupt-partition-* nodes dt-bindings: firmware: ixp4xx: Drop redundant minItems/maxItems dt-bindings: power: Rename back power_domain.txt bindings to fix references dt-bindings: i2c: stm32: Migrate i2c-stm32 documentation to yaml dt-bindings: mtd: Convert stm32 fmc2-nand bindings to json-schema dt-bindings: remoteproc: convert stm32-rproc to json-schema dt-bindings: mailbox: convert stm32-ipcc to json-schema dt-bindings: mfd: Convert stm32 low power timers bindings to json-schema dt-bindings: interrupt-controller: Convert stm32-exti to json-schema dt-bindings: crypto: Convert stm32 HASH bindings to json-schema dt-bindings: rng: Convert stm32 RNG bindings to json-schema dt-bindings: pwm: Convert Samsung PWM bindings to json-schema dt-bindings: pwm: Convert PWM bindings to json-schema dt-bindings: serial: Add a new compatible string for SC9863A dt-bindings: serial: Convert sprd-uart to json-schema dt-bindings: arm: Add bindings for Unisoc SC9863A ...
| * dt-bindings: interconnect: Convert qcom, qcs404 to DT schemaGeorgi Djakov2019-11-052-45/+77
| | | | | | | | | | | | | | Convert the qcom,qcs404 interconnect provider binding to DT schema. Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Signed-off-by: Rob Herring <robh@kernel.org>
* | dt-bindings: interconnect: qcom: add msm8974 bindingsBrian Masney2019-11-081-0/+62
|/ | | | | | | | | | | | | | Add device tree bindings for the Qualcomm MSM8974 interconnect providers that support setting system bandwidth requirements between various network-on-chip fabrics. Signed-off-by: Brian Masney <masneyb@onstation.org> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20191024103054.9770-2-masneyb@onstation.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Link: https://lore.kernel.org/r/20191108125349.24191-2-georgi.djakov@linaro.org Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
* dt-bindings: interconnect: Add Qualcomm QCS404 DT bindingsGeorgi Djakov2019-08-131-0/+45
| | | | | | | | | The Qualcomm QCS404 platform has several buses that could be controlled and tuned according to the bandwidth demand. Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
* dt-bindings: interconnect: Add a dma interconnect nameMaxime Ripard2019-04-101-0/+4
| | | | | | | | | | | | | | The current DT bindings assume that the DMA will be performed by the devices through their parent DT node, and rely on that assumption for the address translation using dma-ranges. However, some SoCs have devices that will perform DMA through another bus, with separate address translation rules. We therefore need to express that relationship, through the special interconnect name "dma-mem". Acked-by: Georgi Djakov <georgi.djakov@linaro.org> Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com> Signed-off-by: Rob Herring <robh@kernel.org>
* interconnect: qcom: Add sdm845 interconnect provider driverDavid Dai2019-01-221-0/+24
| | | | | | | | | | Introduce Qualcomm SDM845 specific provider driver using the interconnect framework. Signed-off-by: David Dai <daidavid1@codeaurora.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
* dt-bindings: Introduce interconnect bindingGeorgi Djakov2019-01-221-0/+60
This binding is intended to represent the relations between interconnect controllers (providers) and consumer device nodes. It will allow creating links between consumers and interconnect paths (exposed by interconnect providers). Reviewed-by: Evan Green <evgreen@chromium.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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