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authorEduardo Valentin <eduardo.valentin@ti.com>2013-07-16 15:26:28 -0400
committerEduardo Valentin <eduardo.valentin@ti.com>2013-09-03 09:10:24 -0400
commita8892d83894bcbd2717846cfa85955152b73453f (patch)
treeae71fac048786708759736daba4ca56dc3b0f73b /block/blk-cgroup.h
parentccba4ffd9eff6120a20cc7656458ac554aec4b0c (diff)
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thermal: thermal_core: allow binding with limits on bind_params
When registering a thermal zone device using platform information via bind_params, the thermal framework will always perform the cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT). This patch changes the data structures so that it is possible to inform what are the desired limits for each trip point inside a bind_param. The way the binding is performed is also changed so that it uses the new data structure. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Diffstat (limited to 'block/blk-cgroup.h')
0 files changed, 0 insertions, 0 deletions
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