From b4c9f578cb9608f7de0c89aa637a6af4a48061ef Mon Sep 17 00:00:00 2001 From: Jingoo Han Date: Tue, 4 Nov 2014 11:01:47 +0900 Subject: usb: dwc3: exynos: remove non-DT support for Exynos Specific Glue layer DWC3 Exynos Specific Glue layer can be used only for Exynos SoCs. In addition, non-DT for EXYNOS SoCs is not supported from v3.11; thus, there is no need to support non-DT for DWC3 Exynos Specific Glue layer. The 'linux/platform_data/dwc3-exynos.h' file has been used for non-DT support. Thus, the 'dwc3-exynos.h' file is removed, because it is not used anymore. Signed-off-by: Jingoo Han Signed-off-by: Felipe Balbi --- drivers/usb/dwc3/Kconfig | 2 +- 1 file changed, 1 insertion(+), 1 deletion(-) (limited to 'drivers/usb/dwc3/Kconfig') diff --git a/drivers/usb/dwc3/Kconfig b/drivers/usb/dwc3/Kconfig index f4e5cc60db0b..58b5b2cde4c5 100644 --- a/drivers/usb/dwc3/Kconfig +++ b/drivers/usb/dwc3/Kconfig @@ -55,7 +55,7 @@ config USB_DWC3_OMAP config USB_DWC3_EXYNOS tristate "Samsung Exynos Platform" - depends on ARCH_EXYNOS || COMPILE_TEST + depends on ARCH_EXYNOS && OF || COMPILE_TEST default USB_DWC3 help Recent Exynos5 SoCs ship with one DesignWare Core USB3 IP inside, -- cgit v1.2.1