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* hwmon: (lm70) Use pr_fmt and pr_<level>Joe Perches2011-01-081-2/+3
| | | | | | | | | | Added #define pr_fmt KBUILD_MODNAME ": " fmt Converted printks to pr_<level> Coalesced any long formats Removed prefixes from formats Signed-off-by: Joe Perches <joe@perches.com> Signed-off-by: Guenter Roeck <guenter.roeck@ericsson.com>
* include cleanup: Update gfp.h and slab.h includes to prepare for breaking ↵Tejun Heo2010-03-301-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | implicit slab.h inclusion from percpu.h percpu.h is included by sched.h and module.h and thus ends up being included when building most .c files. percpu.h includes slab.h which in turn includes gfp.h making everything defined by the two files universally available and complicating inclusion dependencies. percpu.h -> slab.h dependency is about to be removed. Prepare for this change by updating users of gfp and slab facilities include those headers directly instead of assuming availability. As this conversion needs to touch large number of source files, the following script is used as the basis of conversion. http://userweb.kernel.org/~tj/misc/slabh-sweep.py The script does the followings. * Scan files for gfp and slab usages and update includes such that only the necessary includes are there. ie. if only gfp is used, gfp.h, if slab is used, slab.h. * When the script inserts a new include, it looks at the include blocks and try to put the new include such that its order conforms to its surrounding. It's put in the include block which contains core kernel includes, in the same order that the rest are ordered - alphabetical, Christmas tree, rev-Xmas-tree or at the end if there doesn't seem to be any matching order. * If the script can't find a place to put a new include (mostly because the file doesn't have fitting include block), it prints out an error message indicating which .h file needs to be added to the file. The conversion was done in the following steps. 1. The initial automatic conversion of all .c files updated slightly over 4000 files, deleting around 700 includes and adding ~480 gfp.h and ~3000 slab.h inclusions. The script emitted errors for ~400 files. 2. Each error was manually checked. Some didn't need the inclusion, some needed manual addition while adding it to implementation .h or embedding .c file was more appropriate for others. This step added inclusions to around 150 files. 3. The script was run again and the output was compared to the edits from #2 to make sure no file was left behind. 4. Several build tests were done and a couple of problems were fixed. e.g. lib/decompress_*.c used malloc/free() wrappers around slab APIs requiring slab.h to be added manually. 5. The script was run on all .h files but without automatically editing them as sprinkling gfp.h and slab.h inclusions around .h files could easily lead to inclusion dependency hell. Most gfp.h inclusion directives were ignored as stuff from gfp.h was usually wildly available and often used in preprocessor macros. Each slab.h inclusion directive was examined and added manually as necessary. 6. percpu.h was updated not to include slab.h. 7. Build test were done on the following configurations and failures were fixed. CONFIG_GCOV_KERNEL was turned off for all tests (as my distributed build env didn't work with gcov compiles) and a few more options had to be turned off depending on archs to make things build (like ipr on powerpc/64 which failed due to missing writeq). * x86 and x86_64 UP and SMP allmodconfig and a custom test config. * powerpc and powerpc64 SMP allmodconfig * sparc and sparc64 SMP allmodconfig * ia64 SMP allmodconfig * s390 SMP allmodconfig * alpha SMP allmodconfig * um on x86_64 SMP allmodconfig 8. percpu.h modifications were reverted so that it could be applied as a separate patch and serve as bisection point. Given the fact that I had only a couple of failures from tests on step 6, I'm fairly confident about the coverage of this conversion patch. If there is a breakage, it's likely to be something in one of the arch headers which should be easily discoverable easily on most builds of the specific arch. Signed-off-by: Tejun Heo <tj@kernel.org> Guess-its-ok-by: Christoph Lameter <cl@linux-foundation.org> Cc: Ingo Molnar <mingo@redhat.com> Cc: Lee Schermerhorn <Lee.Schermerhorn@hp.com>
* hwmon: lm70: convert to device table matchingAnton Vorontsov2009-09-231-36/+19
| | | | | | | | | | | | | | | Make the code a little bit nicer, and shorter. Signed-off-by: Anton Vorontsov <avorontsov@ru.mvista.com> Cc: Kaiwan N Billimoria <kaiwan@designergraphix.com> Cc: David Brownell <dbrownell@users.sourceforge.net> Cc: David Woodhouse <dwmw2@infradead.org> Cc: Grant Likely <grant.likely@secretlab.ca> Cc: Jean Delvare <khali@linux-fr.org> Cc: Ben Dooks <ben-linux@fluff.org> Cc: Benjamin Herrenschmidt <benh@kernel.crashing.org> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
* hwmon: (lm70) Add TI TMP121 supportManuel Lauss2009-01-071-10/+74
| | | | | | | | | | The Texas Instruments TMP121 is a SPI temperature sensor very similar to the LM70, with slightly higher resolution. This patch extends the LM70 driver to support the TMP121. The TMP123 differs in pin assign- ment. Signed-off-by: Manuel Lauss <mano@roarinelk.homelinux.net> Signed-off-by: Jean Delvare <khali@linux-fr.org>
* hwmon: (lm70) Code streamlining and cleanupKaiwan N Billimoria2009-01-071-4/+5
| | | | | | | | | | | | | | This fixes a byteswap bug in the LM70 temperature sensor driver, which was previously covered up by a converse bug in the driver for the LM70EVAL-LLP board (which is also fixed). Other fixes: doc updates, remove an annoying msleep(), and improve three-wire protocol handling. Signed-off-by: Kaiwan N Billimoria <kaiwan@designergraphix.com> [ dbrownell@users.sourceforge.net: doc and whitespace tweaks ] Signed-off-by: David Brownell <dbrownell@users.sourceforge.net> Signed-off-by: Jean Delvare <khali@linux-fr.org>
* hwmon: (lm70) Convert semaphore to mutexMatthias Kaehlcke2007-11-081-5/+6
| | | | | | Signed-off-by: Matthias Kaehlcke <matthias.kaehlcke@gmail.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Mark M. Hoffman <mhoffman@lightlink.com>
* hwmon: Convert from class_device to deviceTony Jones2007-10-091-6/+6
| | | | | | | | | Convert from class_device to device for hwmon_device_register/unregister Signed-off-by: Tony Jones <tonyj@suse.de> Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de> Signed-off-by: Kay Sievers <kay.sievers@vrfy.org> Signed-off-by: Mark M. Hoffman <mhoffman@lightlink.com>
* hwmon: (lm70) Add a name attributeJean Delvare2007-10-091-2/+13
| | | | | | | | | | | | | | Add a name attribute to the lm70 devices. This is required for libsensors to recognize them. Also drop the "+" before the temperature value, even though it did not cause problems to libsensors, other hardware monitoring drivers don't print it, so it's more consistent that way. Signed-off-by: Jean Delvare <khali@linux-fr.org> Acked-by: Hans de Goede <j.w.r.degoede@hhs.nl> Acked-by: Kaiwan <kaiwan@designergraphix.com> Signed-off-by: Mark M. Hoffman <mhoffman@lightlink.com>
* SPI: add 3wire mode flagDavid Brownell2007-07-171-0/+4
| | | | | | | | | | Add a new spi->mode bit: SPI_3WIRE, for chips where the SI and SO signals are shared (and which are thus only half duplex). Update the LM70 driver to require support for that hardware mode from the controller. Signed-off-by: David Brownell <dbrownell@users.sourceforge.net> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
* hwmon/lm70: Make lm70_remove a __devexit functionRalf Baechle2007-02-141-1/+1
| | | | | | | This fixes a potential broken reference. Signed-off-by: Ralf Baechle <ralf@linux-mips.org> Signed-off-by: Jean Delvare <khali@linux-fr.org>
* [PATCH] lm70: New hardware monitoring driverKaiwan N Billimoria2006-06-221-0/+165
This driver implements support for the National Semiconductor LM70 temperature sensor. The LM70 temperature sensor chip supports a single temperature sensor. It communicates with a host processor (or microcontroller) via an SPI/Microwire Bus interface. Communication with the LM70 is simple: when the temperature is to be sensed, the driver accesses the LM70 using SPI communication: 16 SCLK cycles comprise the MOSI/MISO loop. At the end of the transfer, the 11-bit 2's complement digital temperature (sent via the SIO line), is available in the driver for interpretation. This driver makes use of the kernel's in-core SPI support. Signed-off-by: Kaiwan N Billimoria <kaiwan@designergraphix.com> Signed-off-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
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