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* ARM: dts: OMAP2+: Use existing constants for GPIOsFlorian Vaussard2013-06-181-4/+4
| | | | | | | | | Use standard GPIO constants to enhance the readability of DT GPIOs. Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch> Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com> Reviewed-by: Stephen Warren <swarren@nvidia.com> Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
* ARM: dts: OMAP2+: Use #include for all device treesFlorian Vaussard2013-06-181-1/+1
| | | | | | | | | | Replace /include/ by #include for OMAP2+ DT, in order to use the C pre-processor, making use of #define features possible. Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch> Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com> Reviewed-by: Stephen Warren <swarren@nvidia.com> Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
* ARM: dts: omap3-igep0030: Add NAND flash supportJavier Martinez Canillas2013-06-181-0/+50
| | | | | | | | | The IGEP COM Module has an 512MB NAND flash memory. Add a device node for this NAND and its partition layout. Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk> Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
* ARM: dts: omap3: Add support for IGEP COM ModuleJavier Martinez Canillas2013-04-091-0/+44
ISEE IGEP COM Module is an TI OMAP3 SoC computer on module. This patch adds an initial device tree support to boot an IGEP COM Module from the MMC/SD. Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk> Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com> [b-cousson@ti.com: Update the Makefile for 3.8-rc2] Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
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