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authorAnton Tikhomirov <av.tikhomirov@samsung.com>2012-02-15 17:04:56 +0900
committerFelipe Balbi <balbi@ti.com>2012-03-02 12:11:28 +0200
commitd28a9689c93195d39f91f35a9519876688605b65 (patch)
tree39d7c0b3f80657039cefc3996c20010bdbabbed0 /include/linux/platform_data
parentf6bafc6a1c9d58f0c234ac5052b9c09b0747348c (diff)
downloadblackbird-op-linux-d28a9689c93195d39f91f35a9519876688605b65.tar.gz
blackbird-op-linux-d28a9689c93195d39f91f35a9519876688605b65.zip
usb: dwc3: Add Exynos Specific Glue layer
Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com>
Diffstat (limited to 'include/linux/platform_data')
-rw-r--r--include/linux/platform_data/dwc3-exynos.h24
1 files changed, 24 insertions, 0 deletions
diff --git a/include/linux/platform_data/dwc3-exynos.h b/include/linux/platform_data/dwc3-exynos.h
new file mode 100644
index 000000000000..5eb7da9b3772
--- /dev/null
+++ b/include/linux/platform_data/dwc3-exynos.h
@@ -0,0 +1,24 @@
+/**
+ * dwc3-exynos.h - Samsung EXYNOS DWC3 Specific Glue layer, header.
+ *
+ * Copyright (c) 2012 Samsung Electronics Co., Ltd.
+ * http://www.samsung.com
+ *
+ * Author: Anton Tikhomirov <av.tikhomirov@samsung.com>
+ *
+ * This program is free software; you can redistribute it and/or modify
+ * it under the terms of the GNU General Public License as published by
+ * the Free Software Foundation; either version 2 of the License, or
+ * (at your option) any later version.
+ */
+
+#ifndef _DWC3_EXYNOS_H_
+#define _DWC3_EXYNOS_H_
+
+struct dwc3_exynos_data {
+ int phy_type;
+ int (*phy_init)(struct platform_device *pdev, int type);
+ int (*phy_exit)(struct platform_device *pdev, int type);
+};
+
+#endif /* _DWC3_EXYNOS_H_ */
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