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authorAuke Kok <auke-jan.h.kok@intel.com>2006-06-08 11:15:35 -0700
committerAuke Kok <juke-jan.h.kok@intel.com>2006-06-08 11:15:35 -0700
commit6224e01dccf2543a8f8b4d825baf1510c79c2878 (patch)
tree3d4c7e59b0e1ba7ac0f5eaf211c04049feb9fe1c /drivers/acpi/processor_thermal.c
parent9026729bfeb4329a4edc01f427f01af7ee0a5273 (diff)
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[DOC] Update bonding documentation with sysfs info
Bonding documentation needed an update to include sysfs specific information. This patch adds information on how to change bonding parameters at runtime using the sysfs interface. Signed-off-by: Mitch Williams <mitch.a.williams@intel.com> Signed-off-by: Auke Kok <auke-jan.h.kok@intel.com>
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