/* * (C) Copyright 2009 * Stefano Babic DENX Software Engineering sbabic@denx.de. * * (C) Copyright 2010 * Klaus Steinhammer TTECH Control Gmbh kst@tttech.com * * SPDX-License-Identifier: GPL-2.0+ * * Refer doc/README.imximage for more details about how-to configure * and create imximage boot image * * The syntax is taken as close as possible with the kwbimage */ /* * Boot Device : one of * spi, nand, onenand, sd */ BOOT_FROM spi /* * Device Configuration Data (DCD) * * Each entry must have the format: * Addr-type Address Value * * where: * Addr-type register length (1,2 or 4 bytes) * Address absolute address of the register * value value to be stored in the register */ /* * ####################### * ### Disable WDOG ### * ####################### */ DATA 2 0x73f98000 0x30 /* * ####################### * ### SET DDR Clk ### * ####################### */ /* CCM: CBMCR - ddr_clk_sel: axi_b (133MHz) */ DATA 4 0x73FD4018 0x000024C0 /* DOUBLE SPI CLK (13MHz->26 MHz Clock) */ DATA 4 0x73FD4038 0x2010241 /* IOMUXC_SW_PAD_CTL_PAD_CSPI1_MOSI HYS_ENABLE | DRV_MAX | SRE_FAST */ DATA 4 0x73fa8600 0x00000107 /* IOMUXC_SW_PAD_CTL_PAD_CSPI1_MISO HYS_ENABLE | DRV_MAX | SRE_FAST */ DATA 4 0x73fa8604 0x00000107 /* IOMUXC_SW_PAD_CTL_PAD_CSPI1_SS0 HYS_ENABLE | PKE_ENABLE | DRV_MAX | SRE_FAST */ DATA 4 0x73fa8608 0x00000187 /* IOMUXC_SW_PAD_CTL_PAD_CSPI1_SS1 HYS_ENABLE | PKE_ENABLE | DRV_MAX | SRE_FAST */ DATA 4 0x73fa860c 0x00000187 /* IOMUXC_SW_PAD_CTL_PAD_CSPI1_SCLK HYS_ENABLE | DRV_MAX | SRE_FAST */ DATA 4 0x73fa8614 0x00000107 /* IOMUXC_SW_PAD_CTL_PAD_DI1_PIN11 HYS_ENABLE | DRV_MAX | SRE_FAST (CSPI1_SS2) */ DATA 4 0x73fa86a8 0x00000187 /* * ####################### * ### Settings IOMUXC ### * ####################### */ /* * DDR IOMUX configuration * Control, Data, Address pads are in their default state: HIGH DS, FAST SR. * IOMUXC_SW_PAD_CTL_PAD_DRAM_SDCLK MAX DS */ DATA 4 0x73fa84b8 0x000000e7 /* PVTC MAX (at GPC, PGR reg) */ /* DATA 4 0x73FD8004 0x1fc00000 */ /* DQM0 DS high slew rate slow */ DATA 4 0x73fa84d4 0x000000e4 /* DQM1 DS high slew rate slow */ DATA 4 0x73fa84d8 0x000000e4 /* DQM2 DS high slew rate slow */ DATA 4 0x73fa84dc 0x000000e4 /* DQM3 DS high slew rate slow */ DATA 4 0x73fa84e0 0x000000e4 /* IOMUXC_SW_PAD_CTL_PAD_DRAM_SDQS0 DS high & SLEW slow */ DATA 4 0x73fa84bc 0x000000c4 /* IOMUXC_SW_PAD_CTL_PAD_DRAM_SDQS1 DS high & SLEW slow */ DATA 4 0x73fa84c0 0x000000c4 /* IOMUXC_SW_PAD_CTL_PAD_DRAM_SDQS2 DS high & SLEW slow */ DATA 4 0x73fa84c4 0x000000c4 /* IOMUXC_SW_PAD_CTL_PAD_DRAM_SDQS3 DS high & SLEW slow */ DATA 4 0x73fa84c8 0x000000c4 /* DRAM_DATA B0 */ DATA 4 0x73fa88a4 0x00000004 /* DRAM_DATA B1 */ DATA 4 0x73fa88ac 0x00000004 /* DRAM_DATA B2 */ DATA 4 0x73fa88b8 0x00000004 /* DRAM_DATA B3 */ DATA 4 0x73fa882c 0x00000004 /* DRAM_DATA B0 slew rate */ DATA 4 0x73fa8878 0x00000000 /* DRAM_DATA B1 slew rate */ DATA 4 0x73fa8880 0x00000000 /* DRAM_DATA B2 slew rate */ DATA 4 0x73fa888c 0x00000000 /* DRAM_DATA B3 slew rate */ DATA 4 0x73fa889c 0x00000000 /* * ####################### * ### Configure SDRAM ### * ####################### */ /* Configure CS0 */ /* ####################### */ /* ESDCTL0: Enable controller */ DATA 4 0x83fd9000 0x83220000 /* Init DRAM on CS0 */ /* ESDSCR: Precharge command */ DATA 4 0x83fd9014 0x04008008 /* ESDSCR: Refresh command */ DATA 4 0x83fd9014 0x00008010 /* ESDSCR: Refresh command */ DATA 4 0x83fd9014 0x00008010 /* ESDSCR: LMR with CAS=3 and BL=3 (Burst Length = 8) */ DATA 4 0x83fd9014 0x00338018 /* ESDSCR: EMR with half Drive strength (= medium strength @ i.MX51) */ DATA 4 0x83fd9014 0x0020801a /* ESDSCR */ DATA 4 0x83fd9014 0x00008000 /* ESDSCR: EMR with full Drive strength */ /* DATA 4 0x83fd9014 0x0000801a */ /* ESDCTL0: 14 ROW, 10 COL, 32Bit, SREF=8 */ DATA 4 0x83fd9000 0xC3220000 /* * ESDCFG0: tRFC:22clks, tXSR:28clks, tXP:2clks, tWTR:2clk, tRP:3clks, tMRD:2clks * tRAS:8clks, tRRD:2clks, tWR:3clks, tRCD:3clks, tRC:11clks * DATA 4 0x83fd9004 0xC33574AA */ /* * micron mDDR * ESDCFG0: tRFC:11clks, tXSR:19clks, tXP:1clks, tWTR:2clk, tRP:3clks, tMRD:2clks * tRAS:7clks, tRRD:2clks, tWR:3clks, tRCD:3clks, tRC:9clks * DATA 4 0x83FD9004 0x101564a8 */ /* * hynix mDDR * ESDCFG0: tRFC:17clks, tXSR:21clks, tXP:3clks, tWTR:1clk, tRP:3clks, tMRD:2clks * tRAS:7clks, tRRD:2clks, tWR:3clks, tRCD:3clks, tRC:9clks */ DATA 4 0x83FD9004 0x704564a8 /* ESDMISC: AP=10, Bank interleaving on, MIF3 en, RALAT=2 */ DATA 4 0x83fd9010 0x000a1700 /* Configure CS1 */ /* ####################### */ /* ESDCTL1: Enable controller */ DATA 4 0x83fd9008 0x83220000 /* Init DRAM on CS1 */ /* ESDSCR: Precharge command */ DATA 4 0x83fd9014 0x0400800c /* ESDSCR: Refresh command */ DATA 4 0x83fd9014 0x00008014 /* ESDSCR: Refresh command */ DATA 4 0x83fd9014 0x00008014 /* ESDSCR: LMR with CAS=3 and BL=3 (Burst Length = 8) */ DATA 4 0x83fd9014 0x0033801c /* ESDSCR: EMR with half Drive strength (= medium strength @ i.MX51) */ DATA 4 0x83fd9014 0x0020801e /* ESDSCR */ DATA 4 0x83fd9014 0x00008004 /* ESDCTL1: 14 ROW, 10 COL, 32Bit, SREF=8 */ DATA 4 0x83fd9008 0xC3220000 /* * ESDCFG1: tRFC:22clks, tXSR:28clks, tXP:2clks, tWTR:2clk, tRP:3clks, tMRD:2clks * tRAS:8clks, tRRD:2clks, tWR:3clks, tRCD:3clks, tRC:11clks * DATA 4 0x83fd900c 0xC33574AA */ /* * micron mDDR * ESDCFG1: tRFC:11clks, tXSR:19clks, tXP:1clks, tWTR:2clk, tRP:3clks, tMRD:2clks * tRAS:7clks, tRRD:2clks, tWR:3clks, tRCD:3clks, tRC:9clks * DATA 4 0x83FD900C 0x101564a8 */ /* * hynix mDDR * ESDCFG0: tRFC:17clks, tXSR:21clks, tXP:3clks, tWTR:1clk, tRP:3clks, tMRD:2clks * tRAS:7clks, tRRD:2clks, tWR:3clks, tRCD:3clks, tRC:9clks */ DATA 4 0x83FD900C 0x704564a8 /* ESDSCR (mDRAM configuration finished) */ DATA 4 0x83FD9014 0x00000004 /* ESDSCR - clear "configuration request" bit */ DATA 4 0x83fd9014 0x00000000